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Senior Electronics Packaging Engineer

TxMQ, Inc. • Atlanta, GA

Posted 29 days ago

Job Snapshot

Full-Time
Experience - At least 5 year(s)
Degree - 4 Year Degree
Defense - Aerospace, Manufacturing, Electronics
Engineering, Manufacturing, Management
Relocation - Yes
52

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Job Description


Senior Electronics Packaging Engineer


Our client in NY is searching for a highly qualified Senior Electronics Packaging Engineer for their ever growing organization.  This is an opportunity to join a billion dollar designer and supplier serving the Aerospace industry! 



SUMMARY:
  This exciting opportunity is responsible for development of electrohydraulic, electromechanical, mechanical and electro pneumatic components and systems that will become new products.  The incumbent independently evaluates, selects and applies standard engineering techniques, procedures and criteria using judgment in making minor adaptations and modifications



RESPONSIBILITIES:

  • Flight Control Actuation Systems, Reliability Prediction and EMI/EMC Fundamentals
  • Computer Skills: Unigraphics/Teamcenter, ANSYS , SINDA/G, Matlab, Microsoft Office
  • Electronic manufacturing experience: High reliability manual and automated soldering (surface mount and through hole), printed circuit board design and specification, metal working including, casting, brazing, stamping, sheet metal and machining , Plastic Enclosure Fabrication Techniques
  • COT’s electronic component (Commercial off the shelf) design insertion, up screening techniques
  • Understanding and application of relevant IPC and MIL standards and guidelines
  • Understanding and application of GD&T for drawings and models
  • Ability to guide and lead packaging design team including designers, drafters, assemblers and technicians and other engineers and analysts
  • Ability to work with larger design teams including design lead, project lead, product and manufacturing engineering, program management, systems and actuation engineering.


Job Requirements


REQUIREMENTS:

  • Bachelor’s degree from an accredited institution in Mechanical, Aerospace, Electronics or other relevant technology or field, Master’s degree in Mechanical or Aerospace Engineering highly desired.
  • Minimum of 5-10 years Engineering level experience
  • 3-5 years of senior, leadership or project management experience within an electronic manufacturing environment
  • Packaging Design expertise
  • Expertise in the development of electrohydraulic, electromechanical, mechanical and electro pneumatic components and systems
  • Must be authorized to work in the US without company sponsorship


SALARY:

  • Salary for this direct hire position will be commensurate with experience in the 6 figure range and will include a competitive benefits package, paid holidays and vacation, room for growth, etc.


HOW TO APPLY:

  • Interested and qualified candidates should submit a Word formatted resume, employment references, and salary history for immediate consideration.
  • Equal Opportunity Employer M/F/D/V

TxMQ, Inc.

Contract, Contract to Hire and Direct Hire Staffing Services and Solutions

www.txmqstaffing.com  |  www.txmq.com




Job ID: AEROELECPACK
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